Applied Materials, Inc. announced on October 26, 2026, that it entered into an agreement to increase its investment in BE Semiconductor Industries N.V. (Besi) to approximately 20 percent of outstanding shares. The expanded share purchase reinforces the companies' long-term strategic partnership in advanced packaging.
Partnership and Collaboration
Applied Materials and BE Semiconductor Industries share a longstanding strategic collaboration that began in 2020. The partnership was recently expanded when Besi joined Applied Materials' EPIC Center as an Innovation Partner.
The collaboration extends beyond hybrid bonding into new interconnect architectures and applications that support the semiconductor industry's AI-driven scaling roadmap. Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, stated that hybrid bonding technology and next-generation interconnect architectures are critical enablers of energy-efficient AI compute performance.
Agreement Details
Applied Materials entered into an accelerated share purchase agreement for the Besi shares. Delivery of the shares is subject to the expiration or termination of the applicable waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976.
Applied Materials views its investment as long term and currently has no intention to increase its investment beyond approximately 20 percent. The company also stated that it does not intend to seek board representation at Besi.
Key facts and where they come from
- Applied Materials is increasing its investment in BE Semiconductor Industries to approximately 20 percent of outstanding shares.
Applied enters into agreement to increase its investment to approximately 20 percent of outstanding shares
- The strategic collaboration between Applied Materials and Besi began in 2020.
The companies have a longstanding strategic collaboration, which began in 2020
- Applied Materials does not intend to seek board representation at Besi.
Applied does not intend to seek board representation at Besi.
